• NAND Technology 3D TLC
• SSD Smart Support Yes
• SSD TBW 600
• SSD Max Sequential Write CDM Up to 6200MB-s
• SSD Max Sequential Read CDM Up to 7000MB-s
• Max Random Read QD32 IOMeter Up to 1.0M IOPS
• Max Random Write QD32 IOMeter Up to 1.0M IOPS
• Interface PCIE* 4 x 4
• Weight 0.025kg
• Storage Form Factor M.2 2230
• Storage Temperature -40°C to +85°C
• Storage Humidity 93-por-ciento RH (40° C)
• SSD Package Contents MP600 MINI M.2 SSD thermal pad for MS Surface installations
• SSD Compatibility M.2 2230 Interface Connector Windows 11 Windows 10 Mac OS X
• Form Factor M.2 2230
• Voltage 3.3V +-- 5-por-ciento
• Vibration 20Hz~80Hz-1.52mm 80Hz~2000Hz-20G
• SSD Shock 1500 G
• SSD Operating Temperature 0°C to +65°C
• DEVSLP PS4: <3mW